doc. no : qw0905-lg 5040-ir rev. : a date : 08 - mar - 2005 data sheet LG5040-IR rectangle type led lamps ligitek electronics co.,ltd. property of ligitek only pb lead-free parts
directivity radiation note : 1.all dimension are in millimeter tolerance is ? 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. part no. LG5040-IR page 1/5 package dimensions ligitek electronics co.,ltd. property of ligitek only 2.0 25.0min 2.54typ 1.0min 0.5 typ 4.0 1.5 max 7.6 0 x 0 100% 50% 75% 25% -60 x -30 x 100% 50% 25% 75% 60 x 30 x
565 ligitek electronics co.,ltd. property of ligitek only absolute maximum ratings at ta=25 j peak wave length f pnm typical electrical & optical characteristics (ta=25 j ) note : 1.the forward voltage data did not including ? 0.1v testing tolerance. 2. the luminous intensity data did not including ? 15% testing tolerance. tstg storage temperature part no material LG5040-IR emitted gap green green diffused lens color soldering temperature tsol part no. LG5040-IR i f forward current operating temperature reverse current @5v power dissipation peak forward current duty 1/10@10khz t opr ir pd i fp parameter symbol -40 ~ +100 luminous intensity @10ma(mcd) viewing angle 2 c 1/2 (deg) forward voltage @20ma(v) spectral halfwidth ??f nm 30 2.6 1.7 min. max. 7.0 4.5 128 min. typ. max 260 j for 5 sec max (2mm from body) j page 2/5 30 ma -40 ~ +85 10 j g a 100 120 ma mw g ratings unit
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( j ) relative intensity@20ma wavelength (nm) forward voltage@20ma normalize @25 j fig.4 relative intensity vs. temperature ambient temperature( j ) relative intensity@20ma normalize @25 j typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage forward current(ma) page forward current(ma) fig.2 relative intensity vs. forward current relative intensity normalize @20ma ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0 10 100 1000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40 -20 0 20 40 60 1.0 1.1 1.2 500 550 600 650 0.0 0.5 1.0 2.0 3.0 4.0 5.0 80 100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 g chip part no. LG5040-IR 3/5
preheat 150 1.preheat: 150~180 c 120 sec max 2.operating temp: above 230 c 40sec max 3.peak temp :250 c max 10sec max 150 210 90 80 120 sec max 540 time(sec) 320 330 ligitek electronics co.,ltd. property of ligitek only 180 250 temp( c) above 230c 40sec max recommended soldering conditions 1. pb-free reflow solder part no. LG5040-IR page 4/5
mil-std-202:103b jis c 7021: b-11 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 1.t.sol=260 j? 5 j 2.dwell time= 10 ? 1sec. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. solderability test 1.t.sol=230 j? 5 j 2.dwell time=5 ? 1sec this test intended to see soldering well performed or not. 1.ta=105 j? 5 j &-40 j? 5 j (10min) (10min) 2.total 10 cycles solder resistance test thermal shock test high temperature high humidity test 1.ta=65 j? 5 j 2.rh=90 %~95% 3.t=240hrs ? 2hrs the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. the purpose of this test is the resistance of the device under tropical for hous. part no. LG5040-IR reliability test: page 5/5 reference standard mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 jis c 7021: b-12 mil-std-883:1008 jis c 7021: b-10 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, + 72hrs) this test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. low temperature storage test 1.ta=-40 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) high temperature storage test operating life test 1.ta=105 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) the purpose of this is the resistance of the device which is laid under ondition of hogh temperature for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. test item test condition description ligitek electronics co.,ltd. property of ligitek only
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